Hard Skills
AdvancedWire Bonding OperationThe ability to operate manual, semi-automatic, or fully automated wire bonding machines to connect fine wires between semiconductors and lead frames.
IntermediateMicroscopic InspectionThe use of high-magnification optical equipment to inspect bond placement, loop height, and bond tail quality.
BasicESD (Electrostatic Discharge) PreventionAdherence to protocols and use of equipment designed to prevent static electricity from damaging sensitive electronic components.
IntermediateTechnical Schematic InterpretationThe ability to read and understand technical drawings, bond maps, and assembly instructions to ensure correct wire placement.
BasicCleanroom Protocol AdherenceFollowing strict environmental control procedures to prevent contamination by dust, hair, or skin in sensitive manufacturing areas.