Hard Skills
IntermediateWafer Slicing and PolishingThe ability to operate precision machinery that cuts silicon ingots into thin wafers and polishes them to specified thickness and smoothness.
IntermediateAutomated Optical Inspection (AOI)Proficiency in using automated systems to scan wafers for microscopic surface defects and dimensional deviations.
IntermediateBasic Electrical TroubleshootingThe capacity to diagnose and resolve minor electrical malfunctions in production equipment, such as fuse replacement or wiring checks.
AdvancedCleanroom Protocol AdherenceStrict compliance with procedures to maintain a contaminant-free environment, including proper gowning and sterile handling of materials.
BasicTechnical Log MaintenanceAccurate recording of machine parameters, production volumes, and equipment maintenance history in digital or paper logs.