Hard Skills
IntermediateSurface Mount Technology (SMT) OperationThe process of operating and maintaining automated machinery used to place electronic components directly onto the surface of printed circuit boards.
AdvancedDie AttachmentThe technical process of bonding a semiconductor chip or die to a substrate or package frame using specialized adhesives or solder.
FoundationalElectrostatic Discharge (ESD) ControlApplying procedures and using equipment such as wrist straps and ionized air to prevent static electricity from damaging sensitive electronic circuits.
IntermediateVisual Inspection under MagnificationThe ability to use high-powered microscopes and Automated Optical Inspection (AOI) systems to identify microscopic defects in semiconductor assemblies.
FoundationalCleanroom Protocol AdherenceFollowing strict hygiene, gowning, and movement regulations to maintain low levels of environmental pollutants such as dust and microbes.
AdvancedMicro-SolderingPerforming high-precision manual soldering on extremely small components where standard soldering techniques are inapplicable.