Hard Skills
AdvancedMicro-solderingThe precision process of joining miniature electronic components using specialized tools and solder under high magnification.
IntermediateTechnical Schematic InterpretationThe ability to read and interpret electronic blueprints, circuit diagrams, and assembly drawings to correctly place components.
IntermediateESD (Electrostatic Discharge) ControlFollowing protocols to prevent static electricity from damaging sensitive microelectronic components during handling and assembly.
ExpertIPC-A-610 Standards ComplianceKnowledge and application of the international quality standards for the acceptability of electronic assemblies.
AdvancedWire BondingThe technique of making interconnections between an integrated circuit and its packaging using fine gold or aluminum wires.
IntermediateOptical InspectionUsing high-power microscopes or Automated Optical Inspection (AOI) systems to detect defects in solder joints and component placement.