Hard Skills
IntermediateDie Bonding Machine OperationSetting up and operating automated or semi-automated equipment to bond semiconductor dice to lead frames or substrates using epoxy or eutectic methods.
IntermediateMicroscopic InspectionPerforming high-magnification visual checks to ensure die alignment, bond line thickness, and absence of contamination or physical damage.
BasicESD Safety ComplianceApplying knowledge of Electrostatic Discharge prevention techniques, including the use of grounding straps, ionizers, and ESD-safe packaging.
IntermediateTechnical Drawing InterpretationReading and following engineering schematics and assembly drawings to determine correct component placement and bonding specifications.
BasicCleanroom Protocol AdherenceStrictly following procedures for entering and working in a controlled environment, including wearing gowns, masks, and hairnets to minimize particulate contamination.