Hard Skills
AdvancedPrecision LappingThe process of using specialized machinery and abrasive slurries to achieve exact thickness and surface flatness on electronic components like quartz crystals.
IntermediateMicroscopic InspectionUsing high-magnification tools to identify surface defects, cracks, or contamination on delicate electronic components.
IntermediateMicrometer and Caliper MeasurementThe use of precision measuring instruments to verify the physical dimensions of fabricated parts against engineering specifications.
BasicESD (Electrostatic Discharge) ControlAdherence to safety protocols and the use of grounding equipment to prevent static electricity from damaging sensitive microelectronics.
IntermediateSoldering and Fine AssemblyThe technique of joining small electronic components to circuit boards or lead wires using molten solder.